TEC1 12706-12712 Heatsink Thermoelectric Peltier Cooler Cooling Plate Module

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Location: Shenzhen, GD
Ships to: US,
Item: 166238004369

Restocking Fee:No
Return shipping will be paid by:Buyer
All returns accepted:Returns Accepted
Item must be returned within:60 Days
Refund will be given as:Money Back
Return policy details:
Unbranded:Unbranded
MPN:Does Not Apply
Country/Region of Manufacture:China
Type:Peltier Cooler
Voltage Rating:12 V
Maximum Cooling Capacity:Various
Current Rating:Various
Series:TEC
Item Width:Various
Item Diameter:Various
Item Length:Various
TEC1 Thermoelectric Peltier Cooler:TEC1 Thermoelectric Peltier Cooler

Introduction to Semiconductor Refrigeration Chip: • Semiconductor refrigeration sheets are a type of heat pump. • Its advantage is that there are no sliding components, which can be applied in situations where space is limited, reliability requirements are high, and there is no refrigerant pollution. Utilize the Peltier effect of semiconductor materials. • When direct current is connected in series through two different semiconductor materials to form a couple, heat can be absorbed and released at both ends of the couple, achieving the purpose of refrigeration. • It is a refrigeration technology that generates negative thermal resistance, characterized by no moving components and high reliability. TEC1 12706-12712 Heatsink Thermoelectric Peltier Cooler Cooling Plate Module Introduction to Semiconductor Refrigeration Chip: • Semiconductor refrigeration sheets are a type of heat pump. • Its advantage is that there are no sliding components, which can be applied in situations where space is limited, reliability requirements are high, and there is no refrigerant pollution. Utilize the Peltier effect of semiconductor materials. • When direct current is connected in series through two different semiconductor materials to form a couple, heat can be absorbed and released at both ends of the couple, achieving the purpose of refrigeration. • It is a refrigeration technology that generates negative thermal resistance, characterized by no moving components and high reliability. ◊ The working state of the cold piece is that one side is cooling and the other is heating. The heating surface must be well dissipated during work. It is strictly forbidden to turn on the power for more than 5 seconds without heat dissipation. ◊ When installing the radiator, be sure to apply thermal grease. ◊ There are literals for cold noodles, and no literals for hot noodles. ◊ If you don’t know the hot and cold side, you can use a 1.5V dry battery to test it. After a few seconds of power on, the hot side (without literal) will be hot, and the cold side (with literal) will be cold. ◊ A radiator or a water cooling device must be installed on the heat dissipation surface, otherwise it will burn. Chip model: TEC1-12703Dimensions: 40*40*4.3mm±0.1, the number of pairs of components is 127Wire specifications: lead length 310mm±5mm, RV standard wire, 5mm tinned single endInternal resistance: 4.0~4.3Ω (ambient temperature 23±1℃, 1 KHZ, AC test)Maximum temperature difference: △Tmax (Qc=0) above 63℃Working current: Imax=3A (when 15.5V starts)Rated voltage: DC12V (Vmax: 15.5V)Cooling power: Qcmax27WAssembly pressure: 85N/cm2Working environment: temperature range -55°C~83°C (excessive ambient temperature will directly affect cooling efficiency)Encapsulation process: standard 704 silicone rubber seal around Chip model: TEC1-12704Dimensions: 40*40*4.0mm, the number of pairs of components is 127Wire specifications: lead length 300±5mm, RV standard wire, single end 5mm, tinnedInternal resistance: 3.0~3.3Ω (ambient temperature 23±1°C, 1KHZ, AC test)Maximum temperature difference: △Tmax (Qc=0) above 63°CWorking current: lmax=4A (when 15.5V starts)Rated voltage: DC12V (Vmax: 15.5V)Cooling power: Qcmax 36WAssembly pressure: 85N/cm2Working environment: temperature range -55°C~83°C (excessive ambient temperature will directly affect cooling efficiency)Encapsulation process: standard 704 silicone rubber seal around Chip model: TEC1-12705Dimensions: 40*40*3.8mm, the number of pairs of components is 127Wire specifications: lead length 100±5mm, RV standard wire, single end 5mm, tinnedInternal resistance: 2.4~2.7Ω (ambient temperature 23±1°C, 1 KHZ, AC test)Maximum temperature difference: △Tmax (QC=0) above 61°CWorking current: ImaX=5 (at 15.5V startup)Rated voltage: DC12V (Vmax: 15.5V)Cooling power: Qcmax 30WAssembly pressure: 85N/cm2Working environment: temperature range -55°C~83°C (excessive ambient temperature will directly affect cooling efficiency)Encapsulation process: standard 704 silicone rubber seal around Chip model: TEC1-12706Dimensions: 40*40*3.7mm, the number of pairs of components is 127Wire specifications: lead length 300±5mm, RV standard wire, single head 5mm, tinnedInternal resistance: 2.0~2.2Ω (ambient temperature 23±1°C, 1 KHZ, AC test)Maximum temperature difference: △Tmax (Qc=0) above 62℃Working current: Imax=6 (4.5A at rated voltage startup)Rated voltage: DC12V (Vmax: 15.5V)Cooling power: Qcmax 60WAssembly pressure: 85Ncm2Working environment: temperature range -55°C~83°C (excessive ambient temperature will directly affect cooling efficiency)Encapsulation process: standard 704 silicone rubber seal around Chip model: TEC1-12707Dimensions: 40*40*3.6mm, the number of pairs of components is 127Wire specifications: lead length 300±5mm, RV standard wire, 5mm tinned single endInternal resistance: 1.8~2.0Ω (ambient temperature 23±1°C, 1 KHZ, AC test)Maximum temperature difference: △Tmax (Qc=0) above 62°CWorking current: Imax=7ARated voltage: DC12V (Vmax: 15.5V)Cooling power: Qcmax 67WAssembly pressure: 85N/cm2Working environment: temperature range -55°C~83°C (excessive ambient temperature will directly affect cooling efficiency)Encapsulation process: standard 704 silicone rubber seal around Chip model: TEC1-12708Dimensions: 40*40*3.5mm, the number of pairs of components is 127Wire specifications: lead length 300±8mm, RV standard wire, 5mm tinned single endInternal resistance: 1.5~1.7Ω (ambient temperature 23±1°C, 1 KHZ, AC test)Maximum temperature difference: △Tmax (Qc=0) above 60°CWorking current: Imax=8ARated voltage: DC12V (Vmax: 15.5V)Cooling power: Qcmax 77WAssembly pressure: 85N/cm2Working environment: temperature range -55°C~83°C (excessive ambient temperature will directly affect cooling efficiency)Encapsulation process: standard 704 silicone rubber seal around Chip model: TEC1-12709Dimensions: 40*40*3.5mm, the number of pairs of components is 127Wire specifications: lead length 200±5mm, RV standard wire, 5mm tinned single endInternal resistance: 1.3~1.5Ω (ambient temperature 23±1°C, 1 KHZ, AC test)Maximum temperature difference: △Tmax (Qc=0) above 61°CWorking current: Imax=9ARated voltage: DC12V (Vmax: 15.5V)Cooling power: Qcmax 85WAssembly pressure: 85N/cm2Working environment: temperature range -55°C~83°C (excessive ambient temperature will directly affect cooling efficiency)Encapsulation process: standard 704 silicone rubber seal around Chip model: TEC1-12710Dimensions: 40*40*3.4mm, the number of pairs of components is 127Wire specifications: lead length 300±8mm, RV standard wire, 5mm tinned single endInternal resistance: 1.2~1.3Ω (ambient temperature 23±1°C, 1 KHZ, AC test)Maximum temperature difference: △Tmax (Qc=0) above 60°CWorking current: Imax=10ARated voltage: DC12V (Vmax: 15.5V)Cooling power: Qcmax 85WAssembly pressure: 85N/cm2Working environment: temperature range -55°C~83°C (excessive ambient temperature will directly affect cooling efficiency)Encapsulation process: standard 704 silicone rubber seal around Chip model: TEC1-12712Dimensions: 40*40*3.3mm, the number of pairs of components is 127Wire specifications: lead length 200±8mm, RV standard wire, 5mm tinned single endInternal resistance: 1.0~1.1Ω (ambient temperature 23±1°C, 1 KHZ, AC test)Maximum temperature difference: △Tmax (Qc=0) above 62°CWorking current: Imax=9.5ARated voltage: DC12V (Vmax: 15.5V)Cooling power: Qcmax 114WAssembly pressure: 85N/cm2Working environment: temperature range -55°C~83°C (excessive ambient temperature will directly affect cooling efficiency)Encapsulation process: standard 704 silicone rubber seal around Chip model: TEC1-19906Dimensions: 40*40*4.2mm, 199 pairs of componentsWire specifications: lead length 155±8mm, soft silicone wire, single-ended 5mm tinnedInternal resistance: 3.0-3.2Ω (ambient temperature 23±1°C, 1 KHZ, AC test)Maximum temperature difference: above 63°CMaximum current: ImaX=6AMaximum voltage: 24VAssembly pressure: 85N/cm2Maximum temperature resistance: 200°C. For normal cooling work, the heat dissipation surface needs to be controlled within 50 degreesWorking environment: temperature range -55°C~83°C (excessive ambient temperature will directly affect cooling efficiency)Encapsulation process: standard epoxy resin sealing around Chip model: TEC1-12706 (high quality)Dimensions: 40*40*4.0±0.1mm, the number of components is 127Wire specifications: lead length 110±5mmInternal resistance: 2.0~2.2Ω (ambient temperature 23±1°C, 1 KHZ AC test)Maximum temperature difference: ≥65°CMaximum current: 6AMaximum voltage: 15.4VCooling power: 53.4WAssembly pressure: 85Ncm2Working environment: temperature range -50°C~80°C (excessive ambient temperature will directly affect cooling efficiency)Encapsulation process: standard 704 silicone rubber seal around 12V semiconductor refrigeration sheet product introduction:♥ Semiconductor coolers bring us a new concept of heat dissipation, so that the temperature of the CPU can be further controlled. With the advent of summer and the rise of ambient temperature, overclocking enthusiasts want to further improve the cooling conditions of the CPU. When the semiconductor cooler is powered on, there will be a certain temperature difference between the plates at both ends. The cooling surface provides a cool environment for the CPU.♥ Semiconductor refrigerators have many uses, and can be used to make portable refrigerators/incubators, hot and cold water dispensers, etc. Also used for heat dissipation of electronic devices. At present, the semiconductor material used in the refrigerator is mainly bismuth telluride, and the impurity is added to form an N-type or P-type semiconductor temperature difference element after special treatment. Taking the common TEC1-12605 in the market as an example, its rated voltage is 2V, its rated current is 5A, its temperature difference can reach 60 degrees Celsius, its dimensions are 40X40X0.4cm, and its weight is about 25 grams. Its working characteristic is that one side is cooling and the other side is heating.♥ After the DC power supply is turned on, the electrons start from the negative electrode (-), first pass through the P-type semiconductor, absorb heat here, and then release the heat when it reaches the N-type semiconductor. On the other side, a temperature difference is caused, thus forming a hot and cold end. You can find more products in different material, type, color , sizes and shapes in our shop! If you have special needs, please contact us, we can customize according to your needs! Package Including: According to your choice. Guarantee: Good Good Good quality. Buy with confidence! We maintain high standards of excellence and strive for customer satisfaction! Shipping We ship to your eBay or Paypal address. Please make sure your eBay and Paypal address is correct before you pay. Contact us / Feedback Please contact us via ebay messages. A response will not be returned via email. All ebay messages will be answered as fast and efficient as possible. Please take a look at more great items offered in my store, and we do hope you enjoy your shopping experience. On Jul 20, 2023 at 12:42:11 PDT, seller added the following information:

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